HiSilicon Hi3690 Kirin 990 4G TSMC 7 nm FinFET (N7) Process Digital Floorplan Analysis

This report presents a Digital Floorplan Analysis of the HI3690 V100 die found inside the HiSilicon Kirin 990 4G (Hi3690) application processor package. The Hi3690 processor was extracted from the Huawei Mate 30 Pro 4G smartphone (model LIO-AL00).

This report contains the following detailed information:

• Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
• Scanning electron microscopy (SEM) plan-view micrographs showing the layout of the die at the levels, including fin/shallow trench isolation (STI), gate, contacts, and minimum pitch metals
• Measurements of horizontal dimensions of some of the major layout features, particularly the pitch and track height of standard cells
• Plan-view optical micrograph of the die delayered to the metal gate level
• Identification of major functional blocks on a gate level die photograph
• Table of functional block sizes and percentage die utilization
• High-resolution top metal and gate level die photographs delivered in the CircuitVision Software
• Cost of die based on the process analysis