Get regular, succinct analysis of emerging power process semiconductor products.
The semiconductor industry is developing new power process technologies using Silicon Carbide (SiC) and Gallium Nitride (GaN) that are smaller and more efficient, with lower losses and higher breakdown voltage.
Silicon (Si) offerings in this space are very mature, but we continue to see noteworthy innovations. This subscription-based service provides you access to our analysis on these cutting-edge products.
Silicon Carbide (SiC)
Gallium Nitride (GaN)
Silicon (Si)
TechInsights’ Power subscription products provide insights into emerging power semiconductor products as they enter mass production in high-volume applications.
Power Essentials
Includes:
- Annual Target
10 PDF reports with supporting images - Analysis Coverage
Device metrics and salient features
Package x-rays and die photos
SEM plan-view images and cross-sectional SEM images
Cross-sectional TEM images and material analysis - Analyst Curation
Tri-annual analyst briefing
Annual patent landscape summary
Annual workshop - Real Time Update
Access to project work in progress (PEF report, analyst briefing, etc.) before it is published
Access to all exploratory work (~30 devices per year)
Silicon Carbide (SiC) Process Flow
Includes:
- Process Flow Analysis (PFA)
Reports showing process architecture, mask list, and integration-level process steps (target: 4 per year) - Process Flow Full Emulation (PFF)
Expands upon the detail provided in PFA reports
Layout GDS fully decomposed into process layers
Provided PDF reports are built using Synopsys Process Explorer
Manipulate report data in Synopsys (requires Synopsys license)
Process Flow Full Emulation reports with supporting images (target: 4 per year) - Analyst
Design technology interaction analysis
Detailed explanation of process integration from wafer-in through wafer-out
Process steps, materials, equipment type, unit process
SEM and TEM cross-sectional and top-view images \
Layer annotations, specific process module, assumptions
Available Custom Services
Includes:
- Product Teardown:
Power electronics product teardown with detailed analysis - Power Process Flow:
Process flow emulation (process steps, tool type, material)
Scope of work addressed on a case-by-case basis; discuss custom options with us - Package Analysis:
Detailed package analysis, cross-sectional package analysis, SEM imaging, SEM-EDS materials analysis - Electrical Characterization:
Transfer characteristics (IDVG), Output characteristics (IDVD), RDSON, Breakdown voltage - Selective Area Electron Diffraction:
TEM-based SAED of the GaN-based epitaxial layers
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