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DRAM Functional Analysis (MFR)

Includes:

  • Executive summary supported with image sets
    • Process node and foundry indentification
    • Cricital dimensions
    • Functional block summary
    • Stacked optical top metal and poly die photo delivered in CircuitVision. Includes calibrated measurement and annotions tools
    • SEM cross-sectional and bevel imaging
    • 13-15 reports/year

 

 

DRAM: SWD and Sense Amp Transistor Characterization

Includes:

  • Transitor Characterization Report (TCR)
    • Universal curves for IOFF vs. ION and IOFF vs. ID, LIN derived from
      • 5 NMOS and 5 PMOS sub wordline driver transistors, across multiple VDD at 85°C
      • 5 NMOS and 5 PMOS sense amp transitors, across multiple VDD at 85°C
    • For each universal curve data point
      • Transistor Characteristics: ID, SAT, ID, Lin, Ioff, VT, Lin & VT, SAT, ΔVGS, Gm, SS, DIBL
      • Output Characteristics
  • Analysis Coverage
    • 4 reports/year
    • Trend Analysis
    • 4 hrs support

 

 
 

DRAM Periphery Design (MDP): Sense Amp, Sub Wordline Driver

Includes:

  • Concise analyst's summary of critical device metrics
    • Circuit schematic diagram of sense amplifier
    • Circuit schematic diagram of a sub wordline driver
    • Detailed stacked SEM images of a delayered DRAM sense amplifier and sub wordline driver delivered in CircuitVision. Includes calibrated measurement and annotation tools
    • ~4 reports/year

 

 

DRAM: Circuit Analysis

Includes:

  • Full Circuit Analysis
    • 1 - Memory Array and Peripherals
    • 2 - Address Path
    • 3 - Data Path
    • 4 - Control Blocks, Configuration and Test Block
    • 5 - Voltage Generators System
  • Select Blocks Circuit Analysis
    • 1 - Memory Array and Peripherals
    • 3 - Data Path
    • 5 - Voltage Generators System*
      *Depending upon events and customer interest, TechInsights may produce 1 Select Blocks Circuit Analysis including blocks (1, 3, 5) or 2 Select Blocks Circuit Analysis including blocks (1, 3)
  • Analysis Coverage
    • Full 1/year
    • Select Blocks 1/year

 

 
 

NAND Functional Analysis

Includes:

  • Analysis Coverage
    • Executive summary supported with image sets
      • Process Node and Foundry Identification
      • Critical Dimensions
      • Functional Block Summary
      • Stacked optical top metal and poly die photo delivered in CircutVision which includes calibrated measurement tools
      • SEM cross-sectional imaging
    • 13-15 reports/year

 

 

NAND Periphery Design (MDP): Page Buffer, Wordline Driver

Includes:

  • Concise analyst's summary of critical device metrics
    • Circuit schematic diagram of a page buffer: decoder, switch, and controller
    • Circuit schematic diagram of a wordline driver: decoder and switch
    • Detailed stacked plan view SEM images of a beveled NAND page buffer and worline driver delivered in CircuitVision. CircuitVision includes calibrated measurement and annotation tools
    • ~4 reports/year

 

 
 

NAND: Circuit Analysis

Includes:

  • Full Circuit Analysis
    • 1 - Memory Array and Peripherals
    • 2 - Address Path
    • 3 - Data Path
    • 4 - Control Blocks, Configuration and Test Block
    • 5 - Voltage Generators System
  • Select Blocks Circuit Analysis
    • 1 - Memory Array and Peripherals
    • 3 - Data Path
    • 5 - Voltage Generators System*
      *Depending upon events and customer interest, TechInsights may produce 1 Select Blocks Circuit Analysis including blocks (1, 3, 5) or 2 Select Blocks Circuit Analysis including blocks (1, 3)
  • Analysis Coverage
    • Full 1/year
    • Select Blocks 1/year

 

 

 
 

Advanced Process

Includes:

  • Advanced Memory Essentials (AME)
    • Focused on leading edge NAND and DRAM memory technology
    • Executive summary supported by large image sets
    • SEM cross-sectional and bevel imaging
    • TEM cross-sectional analysis with TEM EDS
    • 8 reports/year
  • Analysis Coverage
    • Technical trend/roadmap by technology element
    • Design technology interaction analysis
    • Detailed explanation of process integrations
    • Next node predictions
    • 3 briefings/year
    • Trend analysis
    • Forecasting
    • 1 annual seminar
    • 4 hrs support

 

 

Process Flows

*Requires Advanced Process Subscription

Includes:

  • Process Flow Analysis (PFA)
    • Spreadsheets showing process, architecture, mask list, and integration-level process steps
    • 8 Memory / year
  • Process Flow Full Emulation (PFF)
    • PFA content may be updated
    • Layout GDS fully decomposed into process layers
    • 3D Emulation
    • Synopsys Input (Route-Level Deck)*
      *Requires Synopsys license to view and modify
    • 6 Memory / year
  • Analysis Coverage
    • Cell Design technology interaction analysis
    • Detailed explanation of process integration from wafer-in through wafer-out
    • Process steps, materials, equipment type, unit process
    • SEM and TEM cross-sectional and top-view images
    • Layer annotations, specific process module, assumption
    • Trend analysis
    • +4 hrs support

 

 
 

Embedded & Emerging Functional Analysis (MFR)

Includes:

  • Analysis Coverage
    • Focused on leading-edge embedded and emerging memory technology
    • Executive summary supported with image sets
    • Process Node and Foundry Identification
    • Critical Dimensions
    • Functional Block Summary
    • Stacked optical top metal and poly die photo delivered in CircuitVisionTM
    • SEM bevel
    • SEM cross-sectional imaging
    • 4 reports/year

 

 

Embedded & Emerging Process Analysis

Includes:

  • Analysis Coverage
    • Focused on leading-edge embedded and emerging memory
    • Executive summary supported by large image sets
    • SEM cross-sectional and bevel imaging
    • TEM cross-sectional with TEM EDS
    • Technical trend/roadmap by technology element
    • Design technology interaction analysis
    • Detailed explanation of process integrations
    • Next node predictions
    • 4 reports/year
  • Trend Analysis - 1 briefing / year
  • Forecasting
  • Q&A

 

 

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