Techinsights' Image Sensors subscription provides Leadership, Management, and Marketing Teams with the reverse engineering results + trend analyses + informed speculation; helps them identify the opportunities, forecast growth, protect existing product lines, validate competitor and vendor claims, and compare technology element insertion timelines.

For Technology Development Teams, our content educates technical staff on the state-of-the-art technology for existing and pursue markets, benchmark competitors' solutions, compare manufacturing cost adders & design strategies and stimulate new ideas while de-risk product planning and integration strategy.

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The following channels are available in the Image Sensors subscription:

• Device Essentials: Broad coverage of the enabling technologies and pixel architectures in use in array imagers, time-of-flight (ToF), event-driven, biometric, and other optical sensors. Tactical reporting on new solutions as they come to market is augmented by curated analyst content.
• Device Essentials Plus : An extension of the SEM-based Device Essentials (DEF) channel performed on a subset of the annual DEF targets. The DEP channel offers thorough structural and dopant analyses using TEM, TEM-EDS, TEM-EELS, SCM/sMIM, SIMS analytical techniques.
• Process Flow Analysis: Process sequence, including mask name, process and recipe description, method, tool, material, and thickness/depth, and mask count estimate supported by DEP content and 'analyst's experience and informed speculation.
• Imager & Optical Sensor Packaging and Integration Analysis: Structural, materials, and key feature analysis of a wide range of image sensor camera modules and other optical sensing components, including IC-related integration topics.
• Image Signal Processor: Complementary to the more process-centric Device Essentials Channel, this provides floorplan and selected structural analyses of image signal processors (ISP) in high-volume, high-growth, and emerging applications.
• Circuit Analysis: Hierarchical schematics, delivered in a proprietary Cadence-like environment including cross-probing to layout capability, of the active pixels, column readout, ADC, row control, PLL, and Bandgap.