Secrets in Apple's A16 Bionic Chip Revealed!

TechInsights has been hard at work analyzing the remarkable A16 Bionic chip over the past year, and our findings are finally here! Designed by Apple and manufactured using TSMC's cutting-edge 4nm process node, powers the incredible iPhone 14 Pro and 14 Pro Max.

Recent Analysis of Samsung’s Mobile RF Components

Shannon 5800 55M5800A01 As the industry expands its use of 5G, Samsung continues to innovate in the area of mobile communication technologies, including RF transceivers and phased array solutions for mmWave along with 5G-embedded mobile processors. TechInsights has compiled a briefing on Samsung’s

Recent MediaTek Mobile RF Components and Analysis

MT6303P AN10516CW 2.95 x 1.74 - 180nm Mobile RF architecture is constantly increasing in complexity to support multiple standards, and we are discovering new mobile RF components in virtually every new phone release. At the time of this writing, MediaTek holds 14% of the global cellular baseband

SK hynix 96L 3D PUC NAND Analysis

Among memory manufacturers worldwide SK hynix currently holds the 5th position in NAND Flash market share, with 10.3%. They are the latest to release a 9X-layer NAND solution, with the SK hynix 96L 3D PUC NAND. Development of SK hynix’ 96L 3D PUC NAND flash device followed a similar approach to

Deca Technologies Fan-In WLP in Qualcomm PM8150

Posted: August 29, 2019 The fan-In WLP market expected to grow at a steady rate; from $2.9B in 2018 to $4.4B by 2024, at 6.5% CAGR. One of the recent contributors to this market is Deca Technologies, whose M-Series fan-out wafer-level packaging (FOWLP) technology has been adopted by Qualcomm in

Velodyne LiDAR Puck Teardown

Posted: July 22, 2019 According to BIS Research, the automotive LiDAR market was estimated at $353M USD in 2017, and is anticipated to reach $8.32B by 2028. The LiDAR market is set to become one of the most competitive segments of the automotive industry. LiDAR manufacturers, automotive OEMs, and

Ambiq Micro Apollo 3 Blue Ultra-Low Power MCU

Posted: June 11, 2019 Ambiq Micro Apollo 3 Blue Ultra-Low Power MCU The MCU marketplace is crowded and competitive, with semiconductor companies globally increasing R&D spend in this technology area; this market is forecast to reach ~$20B USD in 2019. This continued growth stems from the need for

1y DDR4 DRAM from Samsung, SK hynix and Micron

Posted: June 7, 2019 Samsung LPDDR4X 17 nm 1Y Samsung DDR4 17 nm 1Y Micron MT40A2G4SA-062E 8Gb DDR4 The top 3 DRAM manufacturers (Samsung, SK hynix, and Micron) reached sub-20 nm in 2017 and 2018 with the introduction of 1x. A new milestone was reached with the introduction of 1y by Samsung with

Qualcomm QTM052 mmWave Antenna Module

Posted: May 31, 2019 Qualcomm QTM052 mmWave Antenna Module Qualcomm claims to have “Made the impossible, possible” by incorporating mmWave technology into the mobile RF front end in a small, highly integrated module. There are many challenges associated with the use of mmWave componentry, because of

9X Layer 3D NAND Analysis

Posted: April 10, 2019 TechInsights’ Analysis of Solutions from Samsung, Toshiba, and Intel/Micron TechInsights’ analysis has begun on the much-anticipated 9XL 3D NAND solutions, including: Samsung 92L 3D V-NAND Toshiba 96L 3D BiCS Intel/Micron 96L 3D FG/PUC NAND Flash We are also eagerly